Technical Program

Venue
Indiana Convention Center
Indianapolis, Indiana, USA

Technical Program Dates
Tuesday, May 10 - Friday, May 13, 2016



  


The 2016 TechCon Symposium Topic uses the venue’s “Indy 500” car racing fame as motivation to highlight the role of coating technologies that push the boundaries of innovation to create tomorrow’s competitive products. Just as car racing has introduced revolutionary technologies that have found their way into mainstream vehicles, high-performance coatings and films are the foundation of many product innovations in our daily lives. The Symposium augments our comprehensive TechCon program, including traditional sessions focused on our core technology and the exploration of the unique commercial challenges facing the industry. Together with the 2-day Technology Exhibit, comprehensive Education Program with over 20 Tutorial Courses, and quality networking opportunities, the TechCon is a proven venue to facilitate valuable connections between basic and applied research, scientist and engineer, industrially relevant “problems” and solutions, all in a business-friendly environment.

We invite you to highlight your latest research results, technology accomplishments and business perspectives with a contributed talk at the 2016 TechCon in Indianapolis!

The General Abstract Submission Deadline has passed. Abstracts submitted for the Technical Program will be considered on a case-by-case basis.

Deadline for HEURÉKA! Post-Deadlne Recent Development Session, Poster Session and Vendor Innovators Showcase: 
March 18, 2016


Technical Sessions

Symposium Topic
Leading-Edge Coating Technologies: High Performance Films Shape Tomorrow's Products

Traditional Sessions
Protective, Tribological and Decorative Coatings
Optical Coatings
Large Area Coatings
Emerging Technologies

WebTech Roll-to-Roll Coatings for High-End Applications
Plasma Processing
High Power Impulse Magnetron Sputtering (HIPIMS)

Coatings for Energy Conversion and Related Processes
Coatings and Processes for Biomedical and Environmental Applications
NEW! Fundamentals of Interface Design: a joint session organized with ICMCTF (AVS-ASED)

Spotlight Sessions
Technical Poster Presentations with optional 3-minute oral presentation
HEURÉKA! Post-Deadline Recent Developments
Vendor Innovator’s Showcase


Program Chair
Chris Stoessel, Eastman Chemical Company
650/798-1242  E-mail: stoessel@attglobal.net

Assistant Program Chair
Ralf Bandorf, Fraunhofer Institute IST, Germany
+49/5312155602  E-mail: ralf.bandorf@ist.fraunhofer.de

 

 

Past Program Chair
Scott Walton, U.S. Naval Research Laboratory
202/767-7531  E-mail: scott.walton@nrl.navy.mil

Technical Director
Carl Lampert, Star Science
707/794-0333  E-mail: cmlstar@sonic.net

 

 

 

 

TechCon Calendar

Conference May 9-13
Technical Program May 10-13
Education Program May 9-13
Equipment Exhibit
Wednesday, May 11 12pm-6pm
Thursday, May 12 10am-5pm