XACTIX manufactures dry, highly selective isotropic etching systems. A wide range of systems are available for R&D, pilot production and volume production. These dry isotropic etching tools use xenon difluoride gas to selectively etch silicon, molybdenum, germanium and silicon germanium with little or no attack on the majority of materials. The process can also be tuned to etch or not etch Titanium, Tantalum, Tungsten and their nitrides. These systems are particularly well suited for MEMS release, for etching down to very thin oxide layers, or for many other applications where highly selective isotropic silicon, molybdenum and germanium etching is required.