The new COM-HPC standard hosted by the PICMG opens a completely new level of high-performance embedded and edge computing applications. With congatec’s comprehensive COM-HPC ecosystem consisting of industrial-grade COMs, application-ready Micro-ATX industry-standard carrier board and perfectly matched cooling solutions, OEMs can now develop the next generation of future-oriented high-performance embedded and edge computing systems faster and more reliably than ever before.
Benefits besides significantly reduced time-to-market are also lowest non-recurring engineering costs and highest design-security. Furthermore, congatec’s eco system building blocks enables designers to react very quickly to changing market requirements and efficiently scale the performance of your COM-HPC based embedded systems and edge computing solutions.