Kingston Technology

Fountain Valley,  CA 
United States
  • Booth: 1935

Kingston Technology Company, Inc. is the world’s largest independent manufacturer of memory products and technology solutions.  Over 30 years of expertise designing, manufacturing and testing of embedded memory products (eMMC, eMCP, ePOP, DRAM). These products are ideal for many electronic devices, including: smartphones, tablet PCs, eBook readers, electronic learning products, smart TVs, set-top boxes, smart home appliances and many wearable devices. Beyond its use in consumer products, it is also being rapidly adopted in many other embedded applications, such as Single Board Computers (SBC), robotics, medical devices, networking and building control devices because of its compact size, low-power consumption and numerous enhanced features. With the rapid growth of the IoT market, eMMC is finding its way to newer applications.


  • Embedded Products
    Kingston offers a variety of embedded memory products, including eMMC and DRAM components, to customers worldwide. These products are ideal for memory and storage for many embedded applications....

  • eMMC

    Kingston eMMC™ is an embedded, non-volatile memory system, comprised of both Flash memory and a Flash memory controller, which simplifies the application interface design and frees the host processor from low-level Flash memory management. eMMC is a popular storage component for many consumer electronic devices, including smartphones, tablets and Mobile Internet Devices. It is increasingly adopted in many industrial and embedded applications.

    For developers, eMMC simplifies the interface design and qualification process, resulting in a reduction in time to market and facilitates support for future Flash device offerings.

    Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and embedded products. To better meet the requirement of many space constrained wearable and IoT applications, Kingston released world’s smallest eMMC package with standard JEDEC footprint. The technology specifications of eMMC are managed by JEDEC, the global leader in developing open standards for the microelectronics industry.

    eMMC part numbers & specifications

    Part Number Capacity eMMC Standard Package NAND
    EMMC04G-M627 4GB 5.0/5.1 (HS400) 11.5x13x1.0 MLC
    EMMC04G-M657 4GB 5.0/5.1 (HS400) 9.0x7.5x0.8 MLC
    EMMC08G-M325 8GB 5.0/5.1 (HS400) 11.5x13x1.0 MLC
    EMMC16G-TB29 16GB 5.1 (HS400) 11.5x13x0.8 3D TLC BiCS3
    EMMC32G-TB29 32GB 5.1 (HS400) 11.5x13x0.8 3D TLC BiCS3
    EMMC32G-TA29 32GB 5.1 (HS400) 11.5x13x0.8 3D TLC BiCS3
    EMMC64G-TA29 64GB 5.1 (HS400) 11.5x13x0.8 3D TLC BiCS3
    EMMC128-TB29 128GB 5.1 (HS400) 11.5x13x1.0 3D TLC BiCS3

    I-Temp eMMC

    Kingston’s I-temp eMMC product complies with latest JEDEC eMMC standard and is backward compatible to previous eMMC standards. It has all of the advantages of standard eMMC and the operating temperature range of the device meets industrial operating temperature requirements (-40°C~85°C), making it an ideal storage solution for harsh outdoor environment and automotive applications.

    eMMC Adapter

    For designs that don't have an eMMC footprint laid out yet, these eMMC to SD/MMC adapters let users test eMMC through an SD/MMC slot without changing the PCB layout.

    eMMC Adapter part numbers

    Part Number Description
    EMMC04G-M627-ADP 4GB eMMC Adapter
    EMMC08G-M325-ADP 8GB eMMC Adapter
    EMMC16G-TB29-ADP 16GB eMMC Adapter
    EMMC32G-TA29-ADP 32GB eMMC Adapter
    EMMC64G-TA29-ADP 64GB eMMC Adapter
    EMMC128-TA29-ADP 128GB eMMC Adapter


    Kingston offers a wide range of JEDEC standard eMCP components. eMCP integrates eMMC and low-power DRAM into a package with one small footprint. This solution simplifies system PCB design and speeds time to market. eMCP is an ideal combined storage and memory component for space-constrained systems such as smartphones, tablets, wearables, and various IoT devices.

    eMCP part numbers and specifications


    Kingston ePoP is a highly integrated JEDEC standard component that combines eMMC and LPDRAM into one package with a tiny footprint. ePoP is mounted directly on top of a compatible host CPU, which effectively saves board space, and ensures optimum performance as a result of the memory’s proximity to the host CPU. It is an ideal solution for highly space-constrained systems such as wearables.

    Embedded DRAM

    Kingston DRAM components are designed to meet the needs of embedded devices and are available with low- voltage variants for reduced power consumption.