Kingston eMMC™ is an embedded, non-volatile memory system, comprised of both Flash memory and a Flash memory controller, which simplifies the application interface design and frees the host processor from low-level Flash memory management. eMMC is a popular storage component for many consumer electronic devices, including smartphones, tablets and Mobile Internet Devices. It is increasingly adopted in many industrial and embedded applications.
For developers, eMMC simplifies the interface design and qualification process, resulting in a reduction in time to market and facilitates support for future Flash device offerings.
Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and embedded products. To better meet the requirement of many space constrained wearable and IoT applications, Kingston released world’s smallest eMMC package with standard JEDEC footprint. The technology specifications of eMMC are managed by JEDEC, the global leader in developing open standards for the microelectronics industry.
eMMC part numbers & specifications
|Part Number ||Capacity ||eMMC Standard ||Package ||NAND |
|EMMC04G-M627 ||4GB ||5.0/5.1 (HS400) ||11.5x13x1.0 ||MLC |
|EMMC04G-M657 ||4GB ||5.0/5.1 (HS400) ||9.0x7.5x0.8 ||MLC |
|EMMC08G-M325 ||8GB ||5.0/5.1 (HS400) ||11.5x13x1.0 ||MLC |
|EMMC16G-TB29 ||16GB ||5.1 (HS400) ||11.5x13x0.8 ||3D TLC BiCS3 |
|EMMC32G-TB29 ||32GB ||5.1 (HS400) ||11.5x13x0.8 ||3D TLC BiCS3 |
|EMMC32G-TA29 ||32GB ||5.1 (HS400) ||11.5x13x0.8 ||3D TLC BiCS3 |
|EMMC64G-TA29 ||64GB ||5.1 (HS400) ||11.5x13x0.8 ||3D TLC BiCS3 |
|EMMC128-TB29 ||128GB ||5.1 (HS400) ||11.5x13x1.0 ||3D TLC BiCS3 |
Kingston’s I-temp eMMC product complies with latest JEDEC eMMC standard and is backward compatible to previous eMMC standards. It has all of the advantages of standard eMMC and the operating temperature range of the device meets industrial operating temperature requirements (-40°C~85°C), making it an ideal storage solution for harsh outdoor environment and automotive applications.
For designs that don't have an eMMC footprint laid out yet, these eMMC to SD/MMC adapters let users test eMMC through an SD/MMC slot without changing the PCB layout.
eMMC Adapter part numbers
|Part Number ||Description |
|EMMC04G-M627-ADP ||4GB eMMC Adapter |
|EMMC08G-M325-ADP ||8GB eMMC Adapter |
|EMMC16G-TB29-ADP ||16GB eMMC Adapter |
|EMMC32G-TA29-ADP ||32GB eMMC Adapter |
|EMMC64G-TA29-ADP ||64GB eMMC Adapter |
|EMMC128-TA29-ADP ||128GB eMMC Adapter |
Kingston offers a wide range of JEDEC standard eMCP components. eMCP integrates eMMC and low-power DRAM into a package with one small footprint. This solution simplifies system PCB design and speeds time to market. eMCP is an ideal combined storage and memory component for space-constrained systems such as smartphones, tablets, wearables, and various IoT devices.
eMCP part numbers and specifications
Kingston ePoP is a highly integrated JEDEC standard component that combines eMMC and LPDRAM into one package with a tiny footprint. ePoP is mounted directly on top of a compatible host CPU, which effectively saves board space, and ensures optimum performance as a result of the memory’s proximity to the host CPU. It is an ideal solution for highly space-constrained systems such as wearables.
Kingston DRAM components are designed to meet the needs of embedded devices and are available with low- voltage variants for reduced power consumption.