City of Industry,  CA 
United States
  • Booth: 1937

Premio is a premier global ODM/OEM provider in computing technology from the edge to the cloud. We design and manufacture highly reliable, world-class product solutions for businesses with complex, highly specialized requirements. For over 30 years, our engineering expertise and manufacturing agility have been delivering hardware solutions in enterprise servers/storage, industrial embedded systems and industrial touch panel displays for some of the world’s premier technology companies.

At Premio, we go to extraordinary lengths to solve the most formidable challenges faced by our customers. We do so by becoming more than their partner: we become their 'Inside Outsource' - an extension of their businesses, work cultures, manufacturing processes and operations, modulating our solutions to answer their special needs with speed, agility and precision.

With a state-of-the-art facility in Los Angeles, California (ISO9001, ISO2001, ISO13485) and strategic locations in Taiwan, Malaysia and Germany… Premio provides robust product engineering, flexible speed to market and unlimited manufacturing transparency.

Your Success, Our Commitment!


  • ACO-6000
    The ACO-6000 series is a compact and rugged in-vehicle fanless computer designed for high performance processing involving IoT applications such as fleet management, smart surveillance, real-time data analytics, and much more....

    • Skylake / Kaby Lake - 6th/7th Gen. Intel® Core™ i7 / i5 / i3 Processor (LGA 1151)
    • Power ignition management w/ EN50155 EMC conformity
    • 2x front network module bay for up to 8x LAN / PoE ports with optional M12 connector
    • ACO-6011X: Optional 1x PCI or 1x PCIe x16 slot supporting FHHL cards
    • Up to 32GB DDR4/2133 for memory intensive applications
    • Wide operating temperature (-25°C to 70°C)
    • Vibration Rating: With SSD: 5 Grms, 5 - 500 Hz, 0.5 hr/axis
    • Shock Rating: With SSD: 50G, half sine, 11ms
    • Power protection: Over Voltage Protection (OVP), Over Current Protection (OCP), and Reverse Protection
    • Wireless communication expansion via 3x SIM and 3x mini PCIe slots for LTE, 3G, or Wifi
    • Expansion via 1x universal I/O slots (rear)