Nikon  

Belmont,  CA 
United States
https://www.nikonprecision.com
  • Booth: 542


Visit Nikon Precision at the Sensor Expo Exhibit

Visit Nikon Precision at the Sensor Expo Exhibit

Nikon leverages 100 years of opto-electronic and precision technology experience to deliver high productivity, cost-effective MEMS Steppers to satisfy the unique requirements of many diverse markets. These lithography systems are available with low numerical apertures to maximize depth of focus, and support a variety of field sizes. They also are compatible with a range of substrates and materials, as well as thick films, and extremely warped surfaces. The majority of MEMS Steppers also support critical backside alignment capabilities.

Well over 170 MEMS Steppers are in customer use around the world today, and Nikon continues to focus on expanding the product portfolio for these specialty markets.

Newly developed MEMS Steppers enhance imaging with ghi/i-line capabilities, enable field sizes up to 44 x 44 mm, and support a variety of substrate types and dimensions.

https://www.nikonprecision.com

Brands: Our extensive product portfolio includes specialized lithography solutions for MEMS/LED/packaging applications and backside overlay metrology tooling as well.


 Products

  • MEMS Steppers
    Nikon MEMS Steppers provide extremely diverse processing capabilities. They are successful in meeting customers’ unique requirements for Air Bearing Surface (ABS) fabrication and MEMS applications, and light emitting diodes (LEDs), discretes, and more....

  • Nikon MEMS Steppers provide extremely diverse processing capabilities. They are successful in meeting customers’ unique requirements for not only Air Bearing Surface (ABS) fabrication and MEMS applications, but also for light emitting diodes (LEDs), discretes, and more. MEMS Steppers are also well-suited for patterning Cu Pillar insulating layers as well as the insulating layers used in bumping processes.

    MEMS Steppers use low numerical aperture lens designs specifically optimized for MEMS-type applications, as well as shot-by-shot autofocusing. This combination enables them to deliver the necessary resolution with tremendous depth of focus. Nikon MEMS Steppers also provide a high degree of alignment flexibility, and the majority of MEMS Steppers support critical Backside Alignment (BSA) capabilities as well.

    Nikon continues to focus on expanding MEMS Stepper capabilities to meet varied performance and budgetary objectives for our customers. Newly developed systems maximize productivity, support substrates up to 200 mm, and enhance imaging with ghi/i-line capabilities. In addition, a multitude of add-on functions further boost system performance and yield are available.

    Nikon MEMS steppers feature a variety of field sizes, and deliver optimal cost of ownership, and enhanced overlay to offer customers a superior alternative to Mask Aligners, which have historically been used in back-end and packaging processes.

  • Both Side Measurement (BSM) Systems
    Both Side Measurement (BSM) Systems offer high precision frontside and backside overlay metrology capabilities for MEMS and leading- edge power devices....

  • Nikon Engineering Co. developed the industry-leading Both Side Measurement (BSM) Systems to deliver high precision, dual-side overlay metrology and provide an innovative solution to support critical dual-side patterning optimization. The BSM product portfolio features a variety of alignment and substrate handling capabilities to meet device makers’ specific manufacturing objectives.

    Nikon BSM systems provide frontside (top) and backside (bottom) overlay metrology capabilities. They deliver optimum accuracy by using fixed frontside and backside microscopes to measure both sides of the substrate. Then, by comparing deviations in the measured coordinates of the alignment marks between the frontside and backside, the BSM system can determine:

    • X/Y offsets and X/Y scaling
    • Substrate rotation
    • Perpendicular (substrate orth) offsets

    The BSM metrology tool results can then be incorporated in the stepper exposure recipe parameters to maximize the device processes' yield.


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