Nikon MEMS Steppers provide extremely diverse processing capabilities. They are successful in meeting customers’ unique requirements for not only Air Bearing Surface (ABS) fabrication and MEMS applications, but also for light emitting diodes (LEDs), discretes, and more. MEMS Steppers are also well-suited for patterning Cu Pillar insulating layers as well as the insulating layers used in bumping processes.
MEMS Steppers use low numerical aperture lens designs specifically optimized for MEMS-type applications, as well as shot-by-shot autofocusing. This combination enables them to deliver the necessary resolution with tremendous depth of focus. Nikon MEMS Steppers also provide a high degree of alignment flexibility, and the majority of MEMS Steppers support critical Backside Alignment (BSA) capabilities as well.
Nikon continues to focus on expanding MEMS Stepper capabilities to meet varied performance and budgetary objectives for our customers. Newly developed systems maximize productivity, support substrates up to 200 mm, and enhance imaging with ghi/i-line capabilities. In addition, a multitude of add-on functions further boost system performance and yield are available.
Nikon MEMS steppers feature a variety of field sizes, and deliver optimal cost of ownership, and enhanced overlay to offer customers a superior alternative to Mask Aligners, which have historically been used in back-end and packaging processes.