Photonics Systems Group

Pittsboro,  NC 
United States
https://photonics-systems-holding.com
  • Booth: 243

About Photonics Systems Group

Photonics Systems Group's core companies are InnoLas Solutions GmbH and LS Laser Systems.

InnoLas Solutions is a leader in laser processing of micro-materials. The group designs and produces customized machines and processing systems for high-precision laser applications in the area of photovoltaic, electronics and semiconductor industries alongside precision engineering. It supplies renown, globally active customers in the core markets Europe, North America and Asia. The group has over 100 employees working at its global headquarters in Krailling, Germany, as well as in the North America and in Asia.

LS Laser Systems is a medium-sized company based in Munich, Germany that operates internationally with over 25 years of experience in laser technology. Its core business focuses on developing, producing, distributing, and servicing active and passive laser trimming systems as well as other micro-processing systems. The company has gained an excellent reputation over the course of two and a half decades as a reliable and highly productive partner.

For Information Contact: Isabella.Zauner@innolas-solutions.com

Brands: Photonics Systems Group, Innolas-Solutions, LS Systems, Photonics Systems USA Inc.


 Press Releases

  • The initial Introduction of the Dividos system will take place at the SMT Show in Nuremberg, Germany. The Dividos with superior ablating technology, set’s the new standard for depaneling of printed circuit board systems.
    InnoLas Solutions, a proven leader in the field of laser micro-machining, has now developed the next generation of laser depaneling systems for the printed circuit board industry.

    InnoLas Solutions well known throughout the industry for their Ultra High-end laser systems, including the functional separation of ceramic circuit boards.

    With greater than 20 years of experience with Lasers and Printed circuit boards ties has provided us a unique insight into the requirements within the printed circuit board Industry. InnoLas, has now once again demonstrated that the DIVIDOS, developed with the latest technology for market flexibility, will meet all the requirements now and moving forward in laser depaneling of rigid, ridge-flex and flexible printed circuit boards. Separation of materials with unmatched throughput, in a material stress-free environment, without the typical concerns for residue as found in other processes. In a FULL CUT mode the system can produce up to 30% efficiency gains on printed circuit board separation, when compared to other depaneling systems. The laser which operates without physical contact and is subject to almost no wear, resulting in extremely low operating costs. InnoLas’s new DIVIDOS system meets the requirements of the electronic and automotive industry in particular, and can be automated with many of the leading automation manufacturers using our system standard SMEMA enclosure.   All InnoLas Solutions systems are Industry 4.0 capable and can be operated with all common data interfaces.
    Optionally, using a second galvanometer can up to double the throughput capability of the Dividos.

    Included on the DIVIDOS series are:
    Panel size: 18''x18 ''
    System Accuracy: 50 μm
    System Repeatability: 20 μm
    Optical Registration Tool: InnoLas μVision
    Operating System: Windows 10 IoT


 Products

  • Innolas- Solutions Dividos
    Dividos De-panel systems...

  • InnoLas is pleased to Announce the “DIVIDOS” our latest generation of laser depaneling solutions. 

    The initial Introduction of the Dividos system will take place at the SMT Show in Nuremberg, Germany. The Dividos with superior ablating technology, set’s the new standard for depaneling of printed circuit board systems.
    InnoLas Solutions, a proven leader in the field of laser micro-machining, has now developed the next generation of laser depaneling systems for the printed circuit board industry.

    InnoLas Solutions well known throughout the industry for their Ultra High-end laser systems, including the functional separation of ceramic circuit boards.

    With greater than 20 years of experience with Lasers and Printed circuit boards ties has provided us a unique insight into the requirements within the printed circuit board Industry. InnoLas, has now once again demonstrated that the DIVIDOS, developed with the latest technology for market flexibility, will meet all the requirements now and moving forward in laser depaneling of rigid, ridge-flex and flexible printed circuit boards. Separation of materials with unmatched throughput, in a material stress-free environment, without the typical concerns for residue as found in other processes. In a FULL CUT mode the system can produce up to 30% efficiency gains on printed circuit board separation, when compared to other depaneling systems. The laser which operates without physical contact and is subject to almost no wear, resulting in extremely low operating costs. InnoLas’s new DIVIDOS system meets the requirements of the electronic and automotive industry in particular, and can be automated with many of the leading automation manufacturers using our system standard SMEMA enclosure.   All InnoLas Solutions systems are Industry 4.0 capable and can be operated with all common data interfaces.
    Optionally, using a second galvanometer can up to double the throughput capability of the Dividos.

    Included on the DIVIDOS series are:
    Panel size: 18''x18 ''
    System Accuracy: 50 μm
    System Repeatability: 20 μm
    Optical Registration Tool: InnoLas μVision
    Operating System: Windows 10 IoT


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