Sensor Molding/Encapsulation Systems & Package Development
Boschman Technologies is the world leader of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices. The process, called Film Assisted Molding, is ideal for applicaitons where sensing surfaces, bond pads or heat sinks must be exposed and free of mold compound flash and bleed. This technology is used for MEMS, Sensors, Solar and Optical encapsulation applications using transfer molding of epoxy or silicone based mold compounds, including clear materials. Silver sintering development and systems are also available.
Advanced Packaging Center (APC) serves as a one-stop ship for package research, development, qualification, prototyping and small volume manufacturing services focusing upon MEMS, Sensors and advanced IC and wafer level packaging applications.
Brands: Leader in automatic molding systems using film for the encapsulation of Sensors and MEMS devices. Package development, prototype and small production capabilities are available.