Located in Northern Ohio, SMART Microsystems’ new facility has over 15,000 sq. ft. of ISO 6 (class 1000) and ISO 5 (class 100) cleanrooms. This state of the art facility, furnished with flexible equipment capabilities for assembling a high mix of materials and products, creates a turn-key solution for microelectronic package assembly of MEMS sensors. From prototyping through market entry, they help reduce the total cost of product development. Prototype development and manufacturing capabilities include dicing, die attach/flip chip, vacuum solder reflow, wire bonding, and encapsulation. Their environmental life testing identifies reliability issues early in your MEMS sensor product development. They build early proof-of-concept samples as well as feasibility studies to help you avoid challenges that appear early in process development. SMART Microsystem’s engineering team’s expertise in MEMS sensor products has solved many of these challenges.