QP Technologies’ (formerly Quik-Pak) exclusive Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs.
These custom QFN packages or Open-molded Plastic Packages (OmPP) come in a variety of sizes and are ideal for prototype, mid volume or production volume applications. Ceramic and plastic lids are available and are optional.
Pre-Molded Air Cavity QFN Package Advantages:
RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
Gold Plated QFN Packages
Custom QFN Body Sizes and Lead Counts available off the shelf
Perfect solution for rapid prototyping or volume applications
Proven to work with RF silicon requiring frequencies of 40+Ghz
QP Technologies’ Au/Ni plated custom Air Cavity QFN (OmPP) Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound.