L-TRIS Instruments  

Krailling, 
Germany
http://www.l-tris.com
  • Booth: 1318


Specialist in laser systems for trimming circuits & wafers.

L-TRIS is part of Photonics Systems Group and was founded by the merger of LS Laser Systems and EPP Electronic Production Partners on December 16, 2020.
The company specializes in laser systems for trimming circuits and wafers. As one of the world's leading manufacturers, L-TRIS looks back on more than 30 years of expertise in laser technology.


With the exclusive licensing rights for the trim product portfolio of Electro Scientific Industries, Inc. (ESI), Photonics Systems Group, and with this L-TRIS, receives access to patents and know-how for the production, support and service of the LT22XX, LT31XX, LT41XX & M350 systems. The goal of the agreement is to ensure worldwide service and support for ESI's existing trim customers. Based on this IP, L-TRIS will further develop the trim systems, e.g. in terms of accuracy and dynamics.

Brands: L-TRIS is the outcome of the merger of LS Laser Systems and EPP Electronic Production Partners on 16 December 2020. The two companies will now jointly operate as a new corporate brand.

 Products

  • Sensor Trim™ - CIRCUIT TRIMMING SYSTEM
    LT22xx Series is an advanced platform for trim and test of thin and thick film circuits, hybrids and components including PCBs and SMT as well as resistors, resistor networks, hybrids, temperature sensitive devices (RTDs)....

    • LT2200 – Thick Film Laser Trim System 

    LT2200 is an advanced platform for trim and test of thick film circuits, hybrids and components including PCBs and SMT. 

    LT2210 – Thin Film Laser Trim System 

    LT2210 is a versatile platform for trim and test of thin film resistors, resistor networks, hybrids, temperature sensitive devices (RTDs) and other thin film – small geometry applications. 

    Benefits

    Yield and throughput

    • Absolute coordinates reduce “wandering” of trim positions in step&repeat applications
    • Unification of multiple systems (so-called tool matching)
    • Greater throughput with smaller number of alignments
    • Smaller contact pad geometries possible

    Shortened product setup

    • Trim algorithms can be customized by the user
    • Reduced development time for program creation
    • Use of plug-in components for user interface customization

    Technical data

     

    Beam Positioning 
    Architecture: 

      

    High-speed closed-loop galvanometer scanner

    XY Stage Resolution: 

    1.0 μm 

    XY Stage Repeatability:

    3 μm 

    XY Stage Travel:

    12” x 17”  

    Stage: 

    X, Y, Z, W, Theta 

    Spot size: 

    from 10µm (thin film) up to 30µm (thick film)

    Part loading:  

    Manual or automated

    Options

    • Measurement platform supports passive and active trim applications 
      1. Traceable measurement certification 
      2. Resistance range for 5 milli-Ohms to 1 Gig Ohm 
      3. DC Voltage measurement and sourcing 
      4. VXI and GPIB architecture for 3rd party expandability 
    • Patented beam calibration and vision system hardware for precise laser positioning 
    • Latest generation diode-pumped laser technology for minimum maintenance, long term stability and high reliability 

    Software

    • Graphical user interface for simple job creation and operation  
    • Tool library for fast job setup  
    • Comprehension software API library for advanced applications and custom integration  
  • ChipR Trim™
    High performance chip trim systems designed specifically for thin film or thick film components down to the latest 01005 products.

    https://l-tris.com/laser-machines/chipr-trim/...

    • LT3200 & LT4200 – Thick Film Chip Component Laser Trim System 

    High performance chip trim systems designed specifically for thick film components down to the latest 01005 products. 

    LT3210 & LT4210 – Thin Film Chip Component Laser Trim System 

    High performance chip trim systems designed specifically for thin film components down to the latest 01005 products. 

    Learn more about ChipR Trim™ from our specialists

    Benefits

    Yield control and throughput 

    • Absolute coordinates – minimizes beam “walking”  
    • Superior matching between multiple systems  
    • More throughput with fewer alignments  
    • Enables smaller pad sizes  

    Reduced setup time 

    • End user customization of trim algorithm  
    • Minimized program development time  
    • Insertion of user interface controls via plug in components  

    Technical Data

    Beam Positioning 
    Architecture: 

      

    High-speed closed loop galvanometer scanner 

    XY Stage Resolution:   

    1.0 μm 

    XY Stage Travel:  

    100 x 200 mm  

    Stage: 

    X, Y, Z, W, Theta 

    Spot size: 

    from 10 microns thin film to 30 microns thick film 

    Part loading:  

    automated 

    Options

    • Spot size down to 10 microns  
    • Patented 532 nm diode-pumped laser technology for minimum maintenance, long term stability and high reliability  
    • Patented beam calibration and vision system for automatic alignment and precise laser positioning  
    • High speed handler manages thin substrates used with the latest generation small geometry chip resistors 
    • Wide range measurement system 
      1. 5 milli-Ohms to 1 Gig Ohm  
      2. Traceable measurement certification  

    Software

    ChipTrim™ Software

    • Graphical user environment dedicated to chip trimming
    • Globalized language support
  • Wafer Trim™
    M350 – Active IC Trim System
    M350 is an advanced platform for high precision, high throughput wafer-level optimization of linear and mixed-signal IC devices.

    https://l-tris.com/laser-machines/wafer-trim/...

    • M350 – Active IC Trim System

    M350 is an advanced platform for high precision, high throughput wafer-level optimization of linear and mixed-signal IC devices.

    Learn more about Wafer Trim™ from our specialists

    Benefits

    • Fully integrated state-of-the-art laser trimmer and wafer prober system 
    • Proven superior laser control ensures process consistency & highest yields  
    • Advanced vision and motion subsystems provide dramatically improved positioning & alignment capability  
    • Optional Lasers – Short (SP) & Long (LP) Pulse Duration  

    Technical data

    Beam Positioning 
    Architecture: 

      

    High-speed closed loop galvanometer scanner 

    XY Stage Resolution:   

    0.02 μm 

    XY Stage Accuracy: 

    ± 2.0 μm 

    Wafer Size:  

    Supports 100 – 200 mm wafers

    Stage: 

    X, Y, Z, W, Theta 

    Spot size: 

    6.5 μm to 12 μm (optional 5 μm) 

    Part loading:  

    automated (manual as option) 

    Options

    • 3-axis servo-controlled robot and pre-aligner  
    • Mapping End Effector  
    • Detects presence, absence or cross-slotted for all wafer and substrate types  
    • OCR and Barcode Reader  
    • SEMI character font with checksum and barcode  
    • Light Tower  
    • Tape/Film Frame Option  
    • Probes Cleaning Option  
    • Probe Vision Option  
    • High and low mag viewing of probe pins  

    Software

    User friendly WaferTrim™ software improves efficiency and provides compatibility with existing M310 data setup files 

  • Custom Circuit Trimmer
    LS 9600 TD: Laser trimming system for the electronics industry
    The LS 9600TD laser trimming system automates, streamlines and optimizes your trimming tasks.

    https://l-tris.com/laser-machines/custom-circuit-trimmer/...

    • LS 9600 TD: Laser trimming system for the electronics industry

    The LS 9600TD laser trimming system automates, streamlines and optimizes your trimming tasks. The customized solutions with LS system modules offer the greatest possible flexibility for your application while optimizing costs. The spectrum ranges from OEM systems for integration into production lines and stand-alone systems to complete system solutions with automatic handling, contacting and efficient measurement technology for thick film, thin film and PCB applications. All systems can be expanded with automatic parts supply and removal.

    Learn more about Custom Circut Trimmer from our specialists

    Features

    • Cutting geometry U, I, L, D, J, Shave-Cut or Meander-Cut
    • Automatic pre-, end- and contact test
    • PXIe measurement including switching matrix
    • Automatic camera alignment – edge, pattern and structure detection
    • Full marking capability – text, barcode, 2D code and graphics
    • DC motor driven Probe Assembly
    • Sample type: LS or ACCUPROBE type – customer specific
      Flying Probes
    • Step and repeat function of linear motor
    • Laser power measurement

    Technical data

    Substrate size up to 6″ x 8
    Laser source Nd YAG 1064 nm / 532 nm 
    Machine size 1800 x 1780 x 900 mm 

    Options

    • Manual/motor driven z – axis
    • Motor driven phi-axis
    • Flying Probes
    • Hybrid System – ProbeCard and Flying Probes in one system
    • IEEE / GPIB connection
    • Laser power meter
    • Process suction
    • Valve controlled vacuum pickup
    • Automatic part infeed and outfeed

    Applications

    • Trimming resistors and power capacitors for hybrid technology
    • Available for thick and thin film applications
    • Active and passive trimming with optional marking function

Categories

Product Categories
  • Aerospace
  • Automotive
  • Controllers/Drivers
  • Encoders/LVDTs
  • Fluid Level
  • Internet of Things
  • Medical
  • Networking and Communications
  • Sensors/System Components
  • Wearables

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