QP Technologies (Formerly Quik-Pak)

Escondido,  CA 
United States
https://www.qptechnologies.com/
  • Booth: 1228


We look forward to seeing you at the show.

QP Technologies (formerly Quik-Pak), a division of Promex Industries, is based in Escondido, Calif. We are leaders in microelectronic packaging, assembly, wafer processing, substrate design, and other related services. Our 20,000-square-foot facility is ISO 9001:2015 and ISO-13485:2016 certified, and ITAR registered. These certifications are important to ensure we meet your requirements for quality, regardless of the market(s) that you are working in.

Our over-molded QFN/DFN packages and pre-molded air-cavity QFN packages (OmPP) offer a fast, convenient solution for your needs, ranging from prototype to volume production. We offer same-day assembly services that reduce your time to market, while our advanced assembly services can accommodate such structures as flip chip, stacked die, SiP, chiplets, MCM and CoB.

 Products

  • OmPP (Air Cavity Packages)
    QP Technologies’ Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package designed to provide a high quality, fast solution for your IC packaging and IC assembly needs....

    • QP Technologies’ (formerly Quik-Pak) exclusive Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs. 
    These custom QFN packages or Open-molded Plastic Packages (OmPP) come in a variety of sizes and are ideal for prototype, mid volume or production volume applications. Ceramic and plastic lids are available and are optional. 
    Pre-Molded Air Cavity QFN Package Advantages:
    RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
    Gold Plated QFN Packages
    Superior Bondability
    Custom QFN Body Sizes and Lead Counts available off the shelf
    Perfect solution for rapid prototyping or volume applications
    Proven to work with RF silicon requiring frequencies of 40+Ghz
    QP Technologies’ Au/Ni plated custom Air Cavity QFN (OmPP) Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound.

Categories

Product Categories
  • Aerospace
  • Automation Sensors
  • Automotive
  • Controllers/Drivers
  • Internet of Things
  • Medical
  • MEMS
  • Networking and Communications
  • Sensors/System Components
  • Wireless

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