We look forward to seeing you at the show.
QP Technologies (formerly Quik-Pak), a division of Promex Industries, is based in Escondido, Calif. We are leaders in microelectronic packaging, assembly, wafer processing, substrate design, and other related services. Our 20,000-square-foot facility is ISO 9001:2015 and ISO-13485:2016 certified, and ITAR registered. These certifications are important to ensure we meet your requirements for quality, regardless of the market(s) that you are working in.
Our over-molded QFN/DFN packages and pre-molded air-cavity QFN packages (OmPP) offer a fast, convenient solution for your needs, ranging from prototype to volume production. We offer same-day assembly services that reduce your time to market, while our advanced assembly services can accommodate such structures as flip chip, stacked die, SiP, chiplets, MCM and CoB.