San Jose,  CA 
United States
  • Booth: 243

Please visit 243 to discuss leading edge wafer dicing ideas

GDSI bridges a critical gap in your supply chain, servicing small to medium sized lot requirements often ignored by the large foundries and OSATS. We are frequently utilized by IC test and packaging groups, recognized as “best of breed” for the most demanding wafer thinning and dicing programs, as the rigors of their designs call for tighter controls and performance. Whether you are working on a prototype or wish to transfer a mature program to us, we are interested in your application.


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