In 2010, CurrentRF, a Utah based IC and technology company, designed and produced a breakthrough Dynamic and Digital Power Reduction IC, the CC-100IC, which functions to reduce 40% of the total Dynamic and Digital Power dissipation in systems and ICs. Recently, the Company has matured this technology, and has been able to reduce the 3mm X 3mm CC-100 IC into the form and size of a Power and Ground IC Bondpad, the CurrentRF Powerpad, and the CurrentRF PowerGrid, fitting as a digital powergrid overlay, fitting into the form of any on-chip Digital IP block. Both of these IP products consume almost zero additional area on any IC, while maintaining the 40% total Digital and Dynamic Power reduction performance of the original CC-100 IC.
The CurrentRF PowerPad and CurrentRF PowerGrid are available on any given IC process, planar MOSFET to Finfet technologies, and can be designed to fit into any IC padring or chip interconnect bumped designs (the CurrentRF PowerPad) or on-chip, synthesized digital IP block (the CurrentRF PowerGrid).
Contact CurrentRF for Implementation details.