• Booth: 1337

Femtosecond Laser Micromachining-Highest Precision & Quality

We deliver innovative, precise, and effective laser micromachining solutions for sensors, semiconductors, electronics, biotech, automotive, and other applications.
Owning 18+ years of expertise, we ensure the highest precision & quality on all materials at submicron resolution. 
Whether you require equipment, prototyping, or contract manufacturing services, we will tailor a complete solution to meet your needs.

Femtosecond laser micromachining technologies are a perfect solution for specific tasks in material processing - it ensures ultra-high precision and quality, the ability to fabricate complex objects with submicron resolution, high speed, and excellent repeatability.

We offer a full-service solution:

• Prototyping - rapid prototyping services to test your idea in an actual environment.

• Contract manufacturing - ultra-high precision production services on all materials: glass, sapphire, ceramics, silicon, optical fibers, metal, and plastic.

• Laser workstation development - tailor-made laser system designed for your specific application.

Brands: • Glass wafers • Sensors • Microfluidic chips & devices • Production services • Glass processing services • Prototyping • Laser micromachining workstations


  • Glass Wafers
    Our ability to densely pack tens and hundreds of thousands of through holes in glass wafers allows us to offer price-effective glass wafers for convenient handling and release processes.
    We offer rapid prototyping and production services....

  • Depending on your needs we offer glass wafers that are custom-made according to your design.

    A straight cross-section of the hole enables us to combine more holes than are possible with other technologies and combine large through-holes with narrow channels at the same time.

    We ensure:

    • Ultra-high precision and quality
    • Various types of glass
    • Small feature sizes
    • High aspect ratios unachievable with alternative technologies

    Typical features:

    • A variety of glass types and major suppliers – Corning, Schott, Hoya, AGCWafer size up to 200 mm x 200 mm (8”)
    • Wafer thickness from 30 µm to 10 mm
    • Circular, square, and other-shaped holes
    • Straight hole cross-section | no taper
    • Low chipping <10 μm, typ. none
    • Smooth sidewalls, Ra <1 μm
    • Typical min. hole size 20 µm (round)
    • Positional accuracy ±3 μm
    • No debris on the back and front surfaces
    • No sagging around holes
    • Aspect ratio up to 1:100
    • High throughput and yield
    • Ability to work with metalized glass types (e.g. Au, Pt, Ni, Cr, Mo)
    • Minimal or no post-processing is needed

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