The CurrentRF PowerGrid and PowerPad are embedded Dynamic Power Reduction IP Suitable for Digital PowerGrid and Bondpad Overlays. These IPs are intended to enhance IC Power and Ground Digital PowerGrids and IC Bondpads, leading to an almost zero IC area increase with PowerGrid integration. The IPs feature Capacitance Multiplication, Series Inductance Nullification, EMI Reduction, and Dynamic Power Energy Harvesting. The CurrentRF PowerGrid and PowerPad IP create the lowest Impedance point in IC power grids, aiding in maximum on chip supply line filtering, showing an up to a 600X improvement in effective and reservoir capacitance. These IPs feature a circuit noise activated dynamic input current controlled reservoir capacitance, and can function as a “stand-alone” on Chip DCAPs, or work in parallel with existing DCAP structures. Due to the negative feedback embedded in the IP, the CurrentRF PowerGrid and PowerPad features a 25% reduction in effective series inductance (ESL). The IPs operate by feeding back a portion (nominally 20%) of the bypass current flowing through chip Powergrid bypass capacitors, feeding back out of phase current onto the chip power grid, lessening bypass capacitor deep discharge, and thus less deep recharge from system supplies, reducing overall chip dynamic power draw. These effects substantially reduce RF Emissions from chip power grids making systems less vulnerable to cyber hacking and more secure. The IP draws no current for operation, thus maximizing block efficiency.