UBOTIC Company Limited  

Hong Kong,  N.T. 
Hong Kong
  • Booth: 424

We look forward to seeing everyone at the Sensor Expo!

UBOTIC Company Description


UBOTIC Company Limited provides advanced MEMS & Sensor Package Integration from prototype to production with a focus on low cost open-tool and custom cavity packaging as well as custom housing/lid design and fabrication in EMC, LCP or specialized plastics.  We provide lead-frame and substrate designs along with fabrication of molded air cavity QFN packages (AQFN), LGA, SOIC cavity, custom lids, molded housing, SIP  & More.  Specializing in custom design and materials to meet today’s product environments from Harsh Automotive and Medical to Industrial and Consumer. Additional services include both thermal and electrical modeling along with package qualification and reliability testing.  The factory is certified in TS16949:2009 and ISO9001-2008.

For more information please contact Sales@ubotic.com

Brands: Custom Packaging/SIP Integration Solutions from Cavity QFN Packages, Custom Lids, Custom Housing, Package LF or PCB formats

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".