QP Technologies (Formerly Quik-Pak)  

These custom QFN packages or Open-molded Plastic Packages (OmPP) come in a variety of sizes and are ideal for prototype, mid volume or production volume applications. Ceramic and plastic lids are available and are optional. 

Pre-Molded Air Cavity QFN Package Advantages:

• RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
• Gold Plated QFN Packages
• Superior Bondability
• Custom QFN Body Sizes and Lead Counts available off the shelf
• Perfect solution for rapid prototyping or volume applications
• Proven to work with RF silicon requiring frequencies of 40+Ghz

QP Technologies’ Au/Ni plated custom Air Cavity QFN (OmPP) Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound.

QP Technologies’ OmPP packages have been tested to RF frequencies of 40+GHz and are proven to be a viable yet cheaper alternative to industry standard ceramic for most applications

Using virtually any substrate type, we create turnkey solutions for substrate-based assemblies to meet your unique packaging requirements, with delivery times at least 50 percent faster than those of competitive services. We target both ICs and MEMS, and our ability to accommodate all types of substrates provides engineering flexibility that allows greater design freedom for a wide range of advanced packages.

One key driver for our substrate development service is the increased need for custom RF packages essential to 5G. Technologies in which we specialize, such as laminate quad flat no-lead (QFN) and organic QFN for flip-chips, are well suited to integration and customization. This is due to several factors, including small footprint, quick turn-time for leadframe redesign and fab, and low customization cost.

Demand for custom substrate packages is being driven by a number of other factors, as well:

• Growth of custom ICs
• Stringent speed, power and RF performance requirements (5G requires +40GHz frequencies)
• Inclusion of unique components with unique footprints
• Use of unique, non-square shapes
• Use of chip-scale packaging (CSP) to achieve smaller area and footprint, which is of particular value for medical, biotech and consumer applications

We can tune our process to optimize your desired parameter – size, performance, application – and create a solution in about five weeks, from initial consultation to finished assembly. Our service can also accommodate your needs for 3D packaging, ball grid arrays (BGAs), systems-in-package (SiPs), chiplets and multichip modules (MCMs). With this combination of quality, variety and speed, we continue broadening the reach of our service to address a range of markets, including military, medical, sensors and other custom arenas.

QP Technologies (formerly Quik-Pak) can provide virtually any IC package you need for your prototype devices, such as Open-molded Plastic Packages (OmPP)®, Open Cavity Plastic Packages (OCPP), ceramic IC packages, laminate substrates and even custom IC package configurations.

If you don’t have a specific IC package identified, we can provide technical assistance to select the best IC package for your application.

QP Technologies can convert any existing IC plastic packages, whether dummies, electrical test rejects or excess inventory, into open cavity packages, ready to be assembled with your new die.

QP Technologies’ proprietary reconfiguration process is applicable to packages that you provide or we procure for you, in any size or lead count. Available IC package types include:

• BGA
• DIP
• MLF / MLP / QFN / DFN / LPCC, Open-molded Plastic Packages (OmPP)
• PLCC
• QFP / LQFP / PQFP / TQFP
• SSOP / TSOP / TSSOP / SOIC / SOJ / MSOP / QSOP
• SOT / SC / TO / DPAK