GOWIN Semiconductor Corporation  

San Jose,  CA 
United States
http://www.gowinsemi.com
  • Booth: 801


Looking forward to supporting all your FPGA needs!

GOWIN Semiconductor Corp. accelerates customer innovation worldwide with our cost-effective flash and SRAM-based FPGAs. We focus on optimizing our products for power, size, and speed addressing consumer, automotive, communication, and industrial applications. Our tools allow for quick start and ease of use in design implementation.

We offer the following product ranges:
Low-Density (<10K LUTs): GW1N, GW1NR, GW1NS
Mid-Density (10K<100K LUTs): GW2A, GW2AR
High-Density (100K< LUTs): GW5AT

Brands: LittleBee Arora GoAI GoBridge SecureFPGA RF-FPGA


 Press Releases

  • SAN JOSE, Calif. and GUANGZHOU, China, January. 12, 2023 GOWIN's CEO Jason Zhu is interviewed by the Interface Editorial Department. Jason goes over GOWIN's recent accomplishments and what is in store for 2023. 
     

    • What kind of company is GOWIN Semiconductor?
       

    GOWIN was established in 2014 and I believe the company's value lies in its awareness of how to develop products that customers need to go directly into the market.
     

    • What kind of products are you developing?
       

    Embedded Flash type small FPGA (LittleBee family) mounted on Tang nano board (Sipeed) and higher-grade basic SRAM type FPGA (Arora family). Each of them has a unique product development that is unique from other companies due to implementing additional memory such as pSRAM and SDRAM. We have also developed a USB soft PHY IP which is not found in other companies. In response to market demands, the LittleBee family provides devices with enhanced security functions and devices equipped with Arm Cortex-M3. We always start with the creation of products with the user in mind and provide various types of support along the road to development.
     

    • What is the corporate culture at GOWIN?
       

    When looking at GOWIN from the business and corporate culture aspects, we strive to emphasize creativity.  For example, supporting the Tang Nano on the business side hardly contributes to sales, but we enjoy seeing veteran designers and new hobbyists using the platform to create something new. We would like to expand the base for products like Tang Nano to be used in education and hobby. If a product that is especially easy for young people to use enters the market, GOWIN will eventually be known as a company that supports Tang Nano. I think that supporting creative communities within the space is important for that purpose.
     

    • How is business going?
       

    Since its establishment, the total number of shipments has exceeded 50 million. Starting from the Chinese market, sales have increased tenfold in markets other than China (as of 2021). GOWIN's main target market is industry with in-vehicle automotive being second. In-vehicle sales are mainly in China, and we would like to work in Japan in the future.

    With the spread of EVs, GOWIN has become the No. 1 supplier of FPGAs in China. GOWIN devices are mainly manufactured at TSMC's fab (semiconductor manufacturing facility) in Taiwan. LittleBee and Arora have a process rule of 55nm. The new Arora V we recently announced also uses TSMC's 22nm. We have already acquired AEC-Q100 (in-vehicle standard), but we are planning to acquire functional safety ISO26262 next year.
     

    • What is your future road map?
       

    We are focusing on future product development in 2023. The ES of the Arora V 60K LUT product will be announced in the 2Q of 2023. In parallel with this, the development of the Arora 7 series is underway. We are also considering cloud and data centers in the market, but our policy is to continue with industry as the focus. Currently, there are more cases where users cannot obtain parts or have difficulty grasping the future roadmap. GOWIN will continue to introduce products to the industrial market to solve such problems.
     

    • Could you tell us the position of the Japanese market, or rather, tell us about the top five countries in terms of sales, including China, and give us an approximate ratio?
       

    GOWIN attaches great importance to the Japanese market. We focus on what makes the Japanese market unique and different from other countries. Market sales are divided into four regions. 1st China, 2nd Asia Pacific (including Japan, excluding China), 3rd America (including Canada), 4th EU (including Africa and the Middle East), China 55%, non-China 45%. I mentioned earlier that sales outside of China are growing more than 10 times higher, but domestic sales in China are also growing significantly. Due to supply chain problems and changes in the markets that our competitors were focusing on, we were able to enter markets that we could not previously touch.
     

    • Will demand for FPGA package standards such as QFP and BGA take precedence? Please explain how the creators make decisions.
       

    Packages are driven by market needs. For the maker community, I don't like BGA. Debugging is difficult and expensive, and it is difficult for the user to check whether it is properly implemented. However, we supply BGA for users who need space-saving and more I/O. It is easier for GOWIN to distribute QFN and QFP. Even with a single lead frame for a BGA, each PCB in the chip must be custom-made. A general-purpose package can use a general-purpose lead frame. The number of pins is about 88 at maximum for QFN and at least 100 for QFP. Optimization for space issues and I/O count is something we can finally address.


 Products

  • Arora V SRAM Based FPGAs
    GOWINSEMI’s Arora V FPGA series provides SRAM-based FPGA devices with increased logic resources, interfaces, and performance....

  • GOWINSEMI’s Arora V FPGA series provides SRAM-based FPGA devices with increased logic resources, interfaces and performance.  Arora V FPGAs include DDR3 memory interfacing, 12.5Gbps CDR-based SERDES supporting multiple protocols and flexible packaging options making it the ideal choice for communications, server, imaging, and automotive applications requiring high interface and computing throughput by providing best performance/watt.

    Arora V is supported by GOWIN EDA providing an efficient and easy-to-use FPGA hardware development environment support multiple RTL-based programming languages, synthesis, placement & routing, bitstream generation and download, power analysis and in-device logic analyzer.

    Arora V FPGA Product Features:

    FPGA Fabric Architecture
     

    • Up to 138K LUTs(GW5A(S)(T)-138)
    • Up to 23K LUTs(GW5A-25)
    • Block SRAM with multiple modes
      • Single Port, Semi-Dual Port, True Dual Port, and Semi Dual Port with ECC function
      • Byte write enable
      • ECC error detection and correction
    • High performance DSP
      • Multipliers support 12x12, 27x36, 27x18-bit modes
      • Includes 48-bit accumulator
      • Supports DSP cascading
      • Embedded pipeline and bypass registers
      • Pre-addition operation for filter function
      • Internal feedback loop and barrel shifter
    • Advanced Clocking
      • Up to 16 global clocks
      • Up to 6/12 high-performance PLLs
      • Up to 16/24 high speed edge clocks

    Flexible GPIO

    • Adjustable drive strength
      • 4mA, 8mA, 12mA, 16mA, 24mA drive
    • Bus keeper, pull up/down, and open drain
    • Hot Socket and input hysteresis
    • Slew Rate option for output signal

    ADC

    • 60dB SNR and 1kHz Signal Bandwidth
    • Flexible X-channel oversampling ADC
    • No external voltage source required

    Configuration & Programming

    • JTAG, SSPI, MSPI, CPU, and SERIAL
      • Background programming
      • SPI Flash Programming and Boot
      • Multi-boot
    • Bitstream encryption and Security
    • Configuration Memory Soft Error Recovery(CMSER)
    • mDRP(GW5A)
    • Supports OTP, each device has a unique 64-bit DNA identifier

    High Speed Interfaces

    • SERDES(GW5AT, GW5AST)
      • 270Mbps-12.5Gbps operation
      • CDR (Clock Data Recovery)
      • Dedicated RX and TX Channels
      • Integrated 8b/10b encoder/decoder
      • PCI 2.0 hardcore
        • x1, x2, x4, x8 lanes
        • Supports root complex and end point
    • GW5AST series of FPGA products provide a hardcore processor RiscV AE350_SOC

    • MIPI D-PHY RX hardcore(GW5A(S)(T)-138)
      • 20Gbps D-PHY RX Hard PHY
      • 8 data lanes + 2 clock lanes
      • 2.5Gbps/lane
      • Built-in SoT HS-Sync, word and lane alignment
      • MIPI DSI and MIPI CSI-2 RX link layer IPs
    • MIPI D-PHY RX/TX hardcore(GW5A-25)
      • 4 data lanes + 1 clock lane
      • 2.5Gbps/lane(RX/TX)
      • Built-in SoT HS-Sync, word and lane alignment
      • MIPI DSI and MIPI CSI-2 RX link layer IPs
    • GPIOs supports D-PHY RX/TX(GW5A-25)
      • 1.2Gbps/lane
      • GPIOs can be configured as MIPI DSI and MIPI CSI-2 RX/TX device interface
    • GPIOs support MIPI D-PHY RX(GW5A(S)(T)-138)
      • 1.5Gbps/lane
      • GPIOs can be configured as MIPI DSI and MIPI CSI-2 RX device interface
    • External DRAM Interfaces
      • Supports various memory types
        • DDR2, DDR3, PSRAM, HyperRAM, RPC
      • Up to 1333 Mbps (GW5A(S)(T)-138) or 1066 Mbps (GW5A-25)
  • LittleBee Flash Based FPGAs
    GOWIN’s LittleBee® product family offers flash-based, non-volatile FPGAs with an abundance of logic resources, multiple IO standards, embedded RAM, DSPs, PLLs, embedded security, and additional user flash....

  • The LittleBee® FPGA family is complimented by multiple innovative product line sub-features such as extended memory, hardened ARM Cortex-M processor cores, security and Bluetooth LE expanding its capabilities and usage compared to traditional FPGA products.

    GOWIN Semiconductor also provides highly optimized and easy to use FPGA development software supporting the LittleBee® product family including synthesis, mapping, placement, routing and bitstream generation along with programming tools, embedded logic analyzer, and power calculator. 


    LittleBee FPGA Product Features:
     

      • Small Form Factor

    -As small as 2.3x2.4mm2

      • Embedded Flash

    -Bitstream

    -User

      • Extensive Pipeline Computing Resources

    -Higher DSP Ratio

    -Higher RAM Ratio

      • Flexible Programming Interface

    -JTAG, MSPI, SSPI, I2C, CPU

    -Multi-Boot

      • Serialized Interface Support

    -MIPI CSI-2, MIPI DSI, LVDS, HDMI

    -USB 2.0, PCI, Ethernet

    -DDR3, HyperRAM, PSRAM

      • Embedded Security

    - Bitstream Encryption

    - Device Locking

      • Extension Features

    - Integrated PSRAM

    -Hardened ARM Cortex-M3 and Synopsys ARC MCU Cores

    -Bluetooth Low Energy Transceiver

    -PUF Based Asynchronous Application Security

    -AEC-100Q Automotive Qualified

  • Arora SRAM Based FPGAs
    GOWIN’s Arora family of FPGA ICs offer a ‘best-in-class’ performance/cost ratio making it the ideal choice for compute intensive consumer, industrial, automotive and test equipment applications....

  • GOWIN’s Arora family of FPGA ICs offer a ‘best-in-class’ performance/cost ratio making it the ideal choice for compute intensive consumer, industrial, automotive and test equipment applications.

    These mid-density SRAM based FPGAs offer optimized LUTs, DSPs, BSRAM, serialized I/O for real-time SoC, co-processing and signal processing development.

    The Arora family is complemented by multiple innovative product line sub-features such as embedded PSRAM, DDR and Flash expanding its capabilities and usage compared to traditional FPGA products.

    Arora FPGA Product Features:

     

    • Small Form Factor

    -As small as 8x8mm2

    • High IO Count

    -Up to 607 User IO

    • Serialized Interface Support

    -MIPI CSI-2, MIPI DSI, LVDS, HDMI

    -USB 2.0, PCI, Ethernet

    -DDR3, HyperRAM, PSRAM

    • Extensive Pipeline Computing Resources

    -Higher DSP Ratio

    -Higher RAM Ratio

    • Flexible Programming Interface

    -JTAG, MSPI, SSPI, I2C, CPU

    -Multi-Boot

    • Embedded Security

    -Bitstream Encryption

    -Device Locking

    • Extension Features

    -Integrated PSRAM and DDR3

    -Integrated FLASH

    -AEC-100Q Automotive Qualified

  • GoBridge ASSP
    GoBridge ASSPs are highly integrated, low-power, single-chip devices for interfacing and communicating between various types of peripheral interfaces....

  • GoBridge ASSPs are highly integrated, low-power, single-chip devices for interfacing and communicating between various types of peripheal interfaces. The GoBridge ASSPs are ideal for converting from one type of peripheal interface to another, multiplexing between multiple interfaces or demultiplexing to multiple interfaces.

    The first two devices in the GoBridge ASSP product line are the GWU2X and GWU2U ASSPs, which provide interface conversion between USB and SPI, JTAG, I2C, GPIO and UART. Future ASSP's will be added to the Gowin GoBridge product line soon.

    Bult-in Interface conversion processing and data buffering
    I/O independent power supply, supports 3.3V, 2.5V, 1.8V level standards
    Configurable register map
    Independent clock adjustment
    API provided in C/C++ for host device usage

    • Supports full-speed USB device interface, compatible with the Universal Serial Bus v1.1 specification
    • Built-in USB protocol processing, without device firmware programming
    • I/O independent power supply, supports 3.3V, 2.5V, 1.8V level standards
    • 16 general-purpose input and output pins
    • Supports I2C, SPI and JTAG host interfaces with independent clock adjustment and receive buffer
    • API provided in C/C++ for host device usage
    • Can be used to program Gowin FPGA products using Gowin Programmer

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