QP Technologies (Formerly Quik-Pak)  

Escondido,  CA 
United States
  • Booth: 747

Come visit us at booth 747, we look forward to seeing you.

QP Technologies (formerly Quik-Pak), a division of Promex Industries, is based in Escondido, Calif. We are leaders in microelectronic packaging, assembly, wafer processing, substrate design, and other related services. Our 20,000-square-foot facility is ISO 9001:2015 and ISO-13485:2016 certified, and ITAR registered. These certifications are important to ensure we meet your requirements for quality, regardless of the market(s) that you are working in.

Our over-molded QFN/DFN packages and pre-molded air-cavity QFN packages (OmPP) offer a fast, convenient solution for your needs, ranging from prototype to volume production. We offer same-day assembly services that reduce your time to market, while our advanced assembly services can accommodate such structures as flip chip, stacked die, SiP, chiplets, MCM and CoB.


  • Open-molded Plastic Package (OmPP)
    QP Technologies’ (formerly Quik-Pak) exclusive Open-molded Plastic Package (OmPP) is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and IC assembly needs....

  • These custom QFN packages or Open-molded Plastic Packages (OmPP) come in a variety of sizes and are ideal for prototype, mid volume or production volume applications. Ceramic and plastic lids are available and are optional. 

    Pre-Molded Air Cavity QFN Package Advantages:

    • RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
    • Gold Plated QFN Packages
    • Superior Bondability
    • Custom QFN Body Sizes and Lead Counts available off the shelf
    • Perfect solution for rapid prototyping or volume applications
    • Proven to work with RF silicon requiring frequencies of 40+Ghz

    QP Technologies’ Au/Ni plated custom Air Cavity QFN (OmPP) Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound.

    QP Technologies’ OmPP packages have been tested to RF frequencies of 40+GHz and are proven to be a viable yet cheaper alternative to industry standard ceramic for most applications

  • Substrate Development
    We launched our substrate design, fabrication and assembly service to fill the gaps not met by standard, off-the-shelf packages. Through close collaboration, we create custom packaging solutions to your specifications....

  • Using virtually any substrate type, we create turnkey solutions for substrate-based assemblies to meet your unique packaging requirements, with delivery times at least 50 percent faster than those of competitive services. We target both ICs and MEMS, and our ability to accommodate all types of substrates provides engineering flexibility that allows greater design freedom for a wide range of advanced packages.

    One key driver for our substrate development service is the increased need for custom RF packages essential to 5G. Technologies in which we specialize, such as laminate quad flat no-lead (QFN) and organic QFN for flip-chips, are well suited to integration and customization. This is due to several factors, including small footprint, quick turn-time for leadframe redesign and fab, and low customization cost.

    Demand for custom substrate packages is being driven by a number of other factors, as well:

    • Growth of custom ICs
    • Stringent speed, power and RF performance requirements (5G requires +40GHz frequencies)
    • Inclusion of unique components with unique footprints
    • Use of unique, non-square shapes
    • Use of chip-scale packaging (CSP) to achieve smaller area and footprint, which is of particular value for medical, biotech and consumer applications

    We can tune our process to optimize your desired parameter – size, performance, application – and create a solution in about five weeks, from initial consultation to finished assembly. Our service can also accommodate your needs for 3D packaging, ball grid arrays (BGAs), systems-in-package (SiPs), chiplets and multichip modules (MCMs). With this combination of quality, variety and speed, we continue broadening the reach of our service to address a range of markets, including military, medical, sensors and other custom arenas.

  • Open Cavity Plastic Packages (OCPP)
    Open Cavity Plastic Packages (OCPP) are the ideal platform for new IC prototypes, because they are mechanically and electrically identical to your future transfer molded production parts....

  • QP Technologies (formerly Quik-Pak) can provide virtually any IC package you need for your prototype devices, such as Open-molded Plastic Packages (OmPP)®, Open Cavity Plastic Packages (OCPP), ceramic IC packages, laminate substrates and even custom IC package configurations.

    If you don’t have a specific IC package identified, we can provide technical assistance to select the best IC package for your application.

    QP Technologies can convert any existing IC plastic packages, whether dummies, electrical test rejects or excess inventory, into open cavity packages, ready to be assembled with your new die.

    QP Technologies’ proprietary reconfiguration process is applicable to packages that you provide or we procure for you, in any size or lead count. Available IC package types include:

    • BGA
    • DIP
    • MLF / MLP / QFN / DFN / LPCC, Open-molded Plastic Packages (OmPP)
    • PLCC
    • QFP / LQFP / PQFP / TQFP
    • SOT / SC / TO / DPAK

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