Glass,quartz and glass-Si wafer for MEMS and Optoelectronics
Plan Optik AG a public company from Germany produces wafers from glass, quartz, glass-silicon-compounds and substrates for optoelectronics. Main products are wafers and process carriers from glass and fused silica for MEMS, wafer level packaging and semiconductor processing and process carriers for semiconductor wafers. Plan Optik's wafers do have a very tight thickness tolerance and total thickness variation. Sub-nanometer roughness and materials with adapted coefficient of thermal expansion to semiconductor materials are the main features of these substrates and carriers. All wafers are polished and clean room packed. Diameters from 50 to 300 mm, typical thickness from 100 to 3000 micron. Customized cavities and holes manufactured by wet etching, ultra sonic drilling and sand blasting. Si-glass-compound wafers, micro lens- and conductive via wafers for WLP are also offered. Plan Optik has set the standard in respect to high end glass substrates for the MEMS and semiconductor industry