At ST, we are 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027.
In this hands-on workshop, participants will build an end-to-end AIoT proof of concept using STMicroelectronics’ SensorTile.box PRO, ST AIoT Craft, and Avnet’s /IOTCONNECT™ platform, following a streamlined sensor-to-cloud workflow (ST SensorTile.Box Pro hardware will be provided for use during the workshop). Using real sensor data, participants will train and deploy edge AI models, securely connect devices to the cloud, and visualize live telemetry and inference results through pre-built dashboards.The session highlights how a pre-integrated edge-to-cloud solution with built-in device onboarding, model management, OTA updates, and fleet monitoring - reduces development complexity and accelerates time to market from prototype to scalable deployment.
This workshop focuses on the ISM6HG256X high-g IMU embedded in the X-NUCLEO-IKS5A1 expansion board, which includes motion and environmental MEMS sensors for industrial applications.
Who Should Attend: This workshop is for engineers who want to quickly prototype sensor-based applications and rapidly deploy a proof-of-concept for data acquisition and motion event detection
Cost: $30 (requires advance purchase and covers dev board, dev kit and Mini-B USB cable
Earn Swag, Development kits, and a chance at a Grand Prize - Booth #1036
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STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module
iNEMO inertial modules integrate complementary sensors in compact, robust, and easy-to-assemble inertial measurement units (IMU).
iNEMO system-in-packages (SiP) combine an accelerometer and a gyroscope in a monolithic 6-axis solution.
The integration of multiple sensor outputs ensures the highest accuracy of motion-sensing systems for the most demanding applications, such as enhanced gesture recognition, gaming, augmented reality, indoor navigation, and localization-based services.
The VL53L9CX is STMicroelectronics’ dToF 3D lidar all-in-one module, offering a high spatial resolution of 2.3 K zones. It features a 71° diagonal FoV, with 1° angular resolution across a 55° x 42° FoV. It also delivers accurate ranging from below 5 cm to 9 m.
The combination of long distance ranging and high resolution makes it ideal for applications such as people counting, content monitoring, gesture recognition, smart building, and more
The VB1943 and VD1943 are 5.1 megapixel, 2.25 µm global, and rolling shutter image sensors. They are designed for a wide spectrum of applications that require capturing color and NIR images. Operation of these sensors combines global and rolling shutter technology with an extended dynamic range.