Machine Introduction
Equipped with a fiber laser, this machine is able to drill and cut variable glass materials in high speed and low cost features. Environmental-friendly machining process needs no water and avoids waste water treatment cost. With compared to conventional machining process, laser machining doesn’t wear down any tooling with highly-consistent repeatability. Arbitrary features can be easily designed by CAD files and proceed directly. Environmental-friendly machining process needs no water and avoids waste water treatment cost.
The glass processing system is equipped with cutting-edge laser, motion systems, CCD alignment system, and granite surface plate to provide high precision and high throughput drilling, patterning, and marking processes.
Features and advantages
This machine is designed for glass material drilling/cutting with following advantages
- Drilling 30mm hole @ 2 mm tk. glass, <9 seconds
- Cutting hole size 50 µm to 100 mm (larger size optional)
- Substrate thickness from 50 µm to 10 mm (thicker material optional)
- Dimension tolerance: < 50 µm
- Green process, no water needed
- Standalone and in-line system
- Zero taper, no taper generated during cutting process
- High quality - minimal chipping and micro cracks
- High speed - drilling speed comparable with mechanical drilling
- Customized laser solution available for various applications
- Material diversity, float glass, fused silica, glass with coating, color glass, and more
Application areas
- Home appliance
- Solar Photovoltaic
- Semiconductor
- Electronics
- Automotive
- Scientific research