PostProcess Technologies

2495 Main St, Ste 615
Buffalo,  NY  14214

United States
  • Booth: 1633

PostProcess Technologies is a pioneer of the post-printing industry.  We are the first and only provider of automated and intelligent end-to-end solutions for post-printing of 3D printed parts.  PostProcess Technologies removes the “bottleneck” in the third step of additive manufacturing – post-printing, through a combination of patent-pending integrated technologies including software, hardware, and chemistry.  Our solutions deliver unparalleled consistency and increased throughput as well as enabling greater productivity.  Our range of solutions includes support removal and surface finishing for across all 3D print technologies.  Customers span many industries including aerospace, automotive, dental, consumer goods, defense and medical. For more information, visit


  • PostProcess SLA Resin Removal Solution
    The new PostProcess SLA Resin Removal Solution provides dramatically improved processing times of 5-10 minutes, lower operator attendance time with reduced environmental hazards, and overall improved consistency of end parts.

  • The groundbreaking PostProcess™ SLA Resin Removal solution has been proven to deliver the fastest processing times on the market. Performing complete resin removal on 3D printed SLA parts consistently in 5 to 10 minutes, the system offers unmatched results in cleaning up to 5 times as many parts before detergent saturation versus traditional solvent resin removal.

    This newly developed, patent-pending system was validated in multiple production environments with 8 different resin materials. As a part of PostProcess’ comprehensive hardware, software, and chemistry approach, the solution utilizes patent-pending SVC (Submersed Vortex Cavitation) technology in the DEMI™ and CENTI™ machines and proprietary AUTOMAT3D™ software to achieve unprecedented processing times and end part consistency. Software automation enables hands-free cleaning, precision control of parameters, advanced process monitoring, and proactive maintenance management.

    The longevity of the PostProcess chemistry created for this solution, PG1.2, provides for resin removal on up to 1000 trays* in the DEMI machine before reaching saturation. This increased longevity also reduces the costs of waste disposal and machine downtime as fewer detergent changeouts are required. The PG1.2 chemistry also better addresses health and safety concerns compared with traditional solvent solutions, offering a lower vapor pressure and higher flash point. The new PostProcess solution reduces the overall number of steps and chemical applications required from print to finish, driving increased productivity for technicians.

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